Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterization

The recent push for the “materials by design” paradigm requires synergistic integration of scalable computation, synthesis, and characterization. Among these, techniques efficient measurement thermal transport can be a bottleneck limiting experimental database size, especially diverse materials with range roughness, porosity, anisotropy. Traditional contact measurements have challenges throughput lack spatially resolvable property mapping, while non-contact pump-probe laser methods generally need mirror smooth sample surfaces also require serial raster scanning to achieve mapping. Here, we present structured illumination imaging (SI-TI), new characterization tool based on parallelized all-optical heating thermometry. Experiments representative dense porous bulk as well 3D printed thermoelectric thick film (∼50 μm) demonstrate that SI-TI (1) enables paralleled multiple regions samples without scanning; (2) dynamically adjust pattern purely in software, optimize sensitivity different directions anisotropic materials; (3) tolerate rough (∼3 scratched surfaces. This work highlights avenue adaptivity materials.